Ph.D. Economical Engineering, Univ. of Heidelberg, Germany
- General Manager Projection Lithograhpy, SUSS MicroTec
- Division Manager Photomask Equipment, SUSS MicroTec
- VP Operations, SUSS MicroTec
- General Manager, ANKA Angstromquelle Karlsruhe, Germany
Dr. Markus Arendt is President of SUSS MicroTec Photonic Systems, an equipment supplier for lithography solutions for Advanced Packaging, 3D Integration, and MEMS industries. Throughout his 10 years with SUSS MicroTec, he has held a range of senior-level positions, from Division Head for the Photomask Equipment Division to VP of Operations. Previously, he was General Manager of ANKA Synchrotron Radiation Source, and responsible for the commercialization of products and services with Synchrotron Radiation. Markus holds a Diploma in Engineering from the University of Karlsruhe/Germany, and a Ph.D. in Economic Engineering from the University of Heidelberg/Germany.
- Studies from several FOWLP processes have shown that expansion or shrinkage of the mold compound has a significant contribution to the die placement error, which can result significant overlay errors for vias and redistribution layers. This effect can be much bigger than the error introduced by the pick-and-place accuracy. Managing a good overlay, while maintaining a good Cost of Ownership with high throughput, is one of the key challenges when setting up an FOWLP process.
- The DSC300 Gen3 lithography system of SUSS MicroTec represents the latest generation of its projection scanner technology that is particularly targeting the overlay challenge in FOWLP, while maintaining a superior Cost of Ownership. A methodology is provided showing how the system performs an optical compensation for the magnification error caused by the variation of the mold compound that directly translates into a better overlay, with no resolution loss. An additional correction method is presented when the magnification in X and Y is of different magnitude. Still, the DSC300 Gen3 projection scanner provides its unique features like invariance to die sizes without stitching, exposure of non-repeated patterns, a large depth of focus to enable good quality imaging for uneven resist thickness, and high resolution for thick resists. Results generated with the magnification correction mechanism with respect to overlay, resolution, and throughput will be presented, and we will discuss the cost-of-ownership in comparison to UV stepper and Laser Direct Imaging systems. The DSC300 Gen3 can automatically process 200mm and 300mm wafers. The same projection imaging technology with magnification correction is also available for panel formats.