- M.Eng in Technology Management, University of South Australia
- M.Sc in Financial Engineering & B.Eng in Chemical Engineering, National University of Singapore
Lee Chee Ping is the Regional Technologist and Technical Marketing Manager for Lam Research, focusing on the advanced packaging segment. He has >13 years of semiconductor industry experience and started his career as a thin-film deposition process engineer in Novellus Systems (now Lam Research) supporting IDM & foundry customers in Southeast Asia. Over the last 7 years, he has built broad experience in advanced packaging product marketing and process team management roles, serving OSATs in Asia region. Lee Chee Ping received his M.Eng in Technology Management from the University of South Australia, as well as both M.Sc in Financial Engineering and B.Eng in Chemical Engineering from National University of Singapore.
Advanced packaging technologies are expected to play a significant role in meeting the requirements for next generation automotive electronics. Some of the advanced packaging technologies gaining increased attention include flip chip, fan in wafer-level packaging, high density fan out wafer-level packaging, System-in-Package, and 3D through silicon via interconnect.
This talk will introduce how Lam Research can be a competitive solution partner to drive growth in the advanced packaging market. In particular, automotive solutions place a high priority on safety and quality, attributes which also drive the innovations at Lam Research.